Epoxy resin composition and a resin-sealed semiconductor device

Details Epoxy resin composition and a resin-sealed semiconductor device Epoxy resin composition and a resin-sealed semiconductor device

1988-03-30

1991-08-27

Davis, Jenna

Stock material or miscellaneous articles

Web or sheet containing structurally defined element or...

Including a second component containing structurally defined...

174 522, 428413, 523209, 523466, 523438, B32B 2718, B32B 2738, C08K 336, C08K 906

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active

050432117

ABSTRACT:
An epoxy resin composition useful for sealing a semiconductor device includes 100 parts by weight of epoxy resin, 30-75 parts by weight of phenolic resin, 320-570 parts by weight of silica powder, and 2-30 parts by weight of styrene-butadiene-methyl methacrylate copolymer. The surface of the silica powder is treated, at room temperature, by 0.05-1.00% by weight of silane coupling agent, 0.05-1.00% by weight of a silicone base surface active agent, and 0.15-3.00% by weight of thermosetting silicone rubber.

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