Epoxy resin composition

Details Epoxy resin composition Epoxy resin composition

1988-06-02

1989-10-24

Jacobs, Lewis T.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Processes of preparing a desired or intentional composition...

523435, 523466, 525476, 525482, 525487, 525488, 525490, 525500, 525529, 525531, 525502, 525922, C08K 336, C08L 8310, C08L 6304, C08L 6300

Patent

active

048762989

ABSTRACT:
An epoxy resin composition which is adapted for use as an encapsulator of electronic or electric parts and which comprises an epoxy resin and a curing agent for the epoxy resin. A modified polymer obtained by reaction between an aromatic polymer and a fluorine-containing material is added to the epoxy resin, so that good characteristic properties are imparted to the resultant cured product.

REFERENCES:
patent: 4376174 (1983-03-01), Itoh et al.
patent: 4720515 (1988-01-01), Iji et al.

Affiliated with

Also associated with

Rating

Epoxy resin composition does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Epoxy resin composition, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Epoxy resin composition will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1589686