Epoxy resin composition

Details Epoxy resin composition Epoxy resin composition

1996-06-13

1997-10-14

Gulakowski, Randy

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Mixing of two or more solid polymers; mixing of solid...

525523, 528 87, C08F28310, C08G 810, C08L 6304

Patent

active

056773978

ABSTRACT:
An epoxy resin composition which exhibits a low dielectric constant and a low dielectric dissipation factor as well as an excellent working susceptibility after its curing is provided. The epoxy resin composition contains at least one member selected from a novolak resin (A) prepared by condensing formalin and an alkylphenol compound; and an epoxy resin (B) prepared by glycidylating said novolak resin (A) with an epihalohydrin.

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patent: 4342852 (1982-08-01), Takeda et al.
patent: 4499215 (1985-02-01), Okada
patent: 4529790 (1985-07-01), Kamio et al.
patent: 4755543 (1988-07-01), Bertram et al.
patent: 5151496 (1992-09-01), Bertram et al.

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