Epoxy resin composition

Details Epoxy resin composition Epoxy resin composition

1997-08-27

1998-11-10

Gulakowski, Randy

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Mixing of two or more solid polymers; mixing of solid...

525523, 525534, 523400, 549541, C08F28300

Patent

active

058345701

ABSTRACT:
An epoxy resin composition of this invention is obtained by solidifying epoxy resins represented by the following general formula (1) (wherein G is glycidyl group and R.sup.1 to R.sup.8 are hydrogen atoms, halogen atoms or hydrocarbon groups with 1 to 6 carbon atoms, and n is an integer of 0 to 10) by crystallization and adding epoxy resin curing agents to the resulting solid. It shows good flow and low moisture absorption, cures with excellent heat resistance at soldering temperature and is useful for a variety of applications, in particular, for encapsulating semiconductor devices. ##STR1##

REFERENCES:
patent: 3095429 (1963-06-01), Smith et al.
patent: 3413320 (1968-11-01), Cofer
patent: 3720645 (1973-03-01), Nistri et al.
patent: 4421897 (1983-12-01), Gutekunst et al.
patent: 4935101 (1990-06-01), Shum et al.
patent: 5043184 (1991-08-01), Fuji et al.
patent: 5098965 (1992-03-01), Bauer et al
patent: 5294683 (1994-03-01), Cotting et al.
patent: 5395915 (1995-03-01), Iimuro et al.
Lee et al, "Handbook of Epoxy Resins", McGraw Hill Pub., pp. 5-16 to 5-18 and 14-1 to 14-4, 1982.

Affiliated with

Also associated with

Rating

Epoxy resin composition does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Epoxy resin composition, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Epoxy resin composition will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1517632