Epoxy resin composition

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Mixing of two or more solid polymers; mixing of solid...

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528 98, 549517, C08G 5904

Patent

active

060840390

ABSTRACT:
An epoxy resin which is useful as adhesives, resins for coatings, encapsulants, resins for a lamination board, casting materials, molding compounds, and electric insulators, and which can provide a cured resin having excellent heat resistance and moisture resistance is provided which comprises (A) an epoxy resin containing a trisepoxy compound represented by general formula (I), and (B) a curing agent for an epoxy resin, ##STR1## wherein R.sub.1 is a methyl group, n is an integer of 0 to 2, and Ar is a group selected from general formula (II) ##STR2## wherein R.sub.2 and R.sub.3 are an alkyl group having a carbon number of 1 to 6, an alkoxy group having a carbon number of 1 to 6, or a halogen atom, and m and p are an integer of 0 to 2.

REFERENCES:
patent: 5880246 (1999-03-01), Miura et al.

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