Epoxy resin composition

Details Epoxy resin composition Epoxy resin composition

1990-06-13

1992-09-22

Marquis, Melvyn I.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Processes of preparing a desired or intentional composition...

525481, 525486, 525485, C08L 6302, C08L 6300, C08F28310

Patent

active

051497301

ABSTRACT:
An electrical encapsulation formulation is provided comprising a diglycidyl ether of a 4,4'-dihydroxybiphenyl, a trisphenolic curing agent, a cure accelerator and an inorganic filler. The composition cures rapidly and exhibits excellent resistance to cracking under high-temperature operation.

REFERENCES:
patent: 3989531 (1976-11-01), Orlando et al.
patent: 4058570 (1977-11-01), Kinson et al.
patent: 4072656 (1978-02-01), Hartmann
patent: 4153621 (1979-05-01), Hartmann
patent: 4654382 (1987-03-01), Hiza et al.
patent: 4663400 (1987-05-01), Wang et al.
patent: 4835240 (1989-05-01), Togashi et al.
patent: 4874669 (1989-10-01), Larson et al.

Affiliated with

Also associated with

Rating

Epoxy resin composition does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Epoxy resin composition, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Epoxy resin composition will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1068710