Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Processes of preparing a desired or intentional composition...
Patent
1997-08-26
1999-07-06
Dawson, Robert
Synthetic resins or natural rubbers -- part of the class 520 ser
Synthetic resins
Processes of preparing a desired or intentional composition...
523451, C08K 500, C08L 6302
Patent
active
059198443
DESCRIPTION:
BRIEF SUMMARY
TECHNICAL FIELD
The present invention relates to an epoxy resin composition excellent in flame retardancy, high-temperature reliability and solder heat resistance and, more particularly, to a semiconductor sealing epoxy resin composition and a semiconductor device.
BACKGROUND ART
As for a method for sealing electronic circuit portions, such as semiconductor devices, a sealing method using a sealing resin containing an epoxy rein, a hardening agent and an inorganic filler is mainly employed, in view of cost effectiveness, productivity, and balance in properties. Due to the recent trend toward less thickness and higher packaging density of semiconductor devices, there are increasing demands for high solder heat resistance, high-temperature reliability, humidity resistance reliability and the like of semiconductors. Correspondingly, requirements for sealing resins have been escalating.
For safety ensurance, the UL standards impose a requirement that electronic component parts, such as semiconductor devices, be provided with flame retardancy. Accordingly, conventional sealing resins contain, as a flame retarding agent, halide-based flame retardant agents such as a brominated epoxy resin and, as a flame retarding assistant, antimony compounds such as antimony trioxide.
With recently growing concerns about environmental issues, problems or challenges have been pointed out in respect to various compounds used as flame retarding agents in semiconductor sealing resins.
There is a problem in that when a semiconductor device sealed by an epoxy rein composition containing a halide flame retardant agent is placed in a high temperature environment, the reliability of the semiconductor decreases.
Furthermore, concerns have risen over troublesome processes required for resin wastes if antimony compounds are contained in the such resins.
There have been demands for further improvements in the solder heat resistance and high-temperature reliability of semiconductor devices and the package filling characteristics for the sealing of semiconductors.
It is an object of the present invention to provide an epoxy rein composition excellent in flame retardancy, high-temperature reliability, solder heat resistance and formability represented by package filling characteristics without essentially requiring a halide-based flame retarding agent or an antimony compound, which are conventional flame retarding agents, and to provide an epoxy resin composition that improves the humidity resistance reliability if that property is required.
DISCLOSURE OF THE INVENTION
Accordingly, the present invention is: (B), an inorganic filler (C), and a phosphoric acid ester compound (D), an amount of the inorganic filler (C) contained being 80% by weight relative to the composition, and more particularly, the epoxy rein (A) in the epoxy resin composition is 0.05-15% by weight, and a proportion of the hardener (B) is such that a chemical equivalent ratio of the hardening functional group of the component (B) to the epoxy groups of the component (A) is 0.5-1.5, and a proportion of the phosphoric acid ester compound (D) is such that the phosphorous atoms of the phosphoric acid ester compound (D) is 0.01-10% by weight relative to the components excluding the inorganic filler, phosphorous atom of the phosphoric acid ester compound has a valency of five, the phosphoric acid ester compound has an aromatic group, the phosphoric acid ester compound (D) has in its molecule a structure of the following chemical formula (I): ##STR1## (in the fomula, X represents at least one aromatic group, and may be the same or different) the epoxy resin composition contains an ion capturing agent, capturing agent is a hydrotalcite-based compound, the epoxy resin (A) comprises as an essential element a biphenyl type epoxy component having a structure of the following chemical formula (II): ##STR2## (where R1-R8 in the formula represent hydrogen atoms, alkyl groups having a carbon number of 1-4, or halogen atoms), the hardener comprises as an essential component a phenol c
REFERENCES:
patent: 5346743 (1994-09-01), Uchida et al.
Shimizu Ken
Tanaka Masayuki
Tokunaga Atsuto
Aylward D.
Dawson Robert
Miller Austin R.
Toray Industries Inc.
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