Epoxy resin composition

Details Epoxy resin composition Epoxy resin composition

1993-09-15

1995-05-16

Bleutge, John C.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Processes of preparing a desired or intentional composition...

525481, 525501, 525 98, 525153, C08K 336, C08L 6112, C08L 6300

Patent

active

054161380

ABSTRACT:
An epoxy resin composition used for sealing of semiconductor devices, comprising as essential components:

REFERENCES:
patent: 3378525 (1968-04-01), Sellers
patent: 5001174 (1991-03-01), Yanagisawa
N. P. Preuss, "Synthetic Resins In Coatings 1965", Noyes Development Corp., Pearl River New York pp. 212-214 (1965).
42nd Electronic Components & Technology Conference May 18-20, 1992, Mogi et al., "Development of High-Reliability Epoxy Molding Compounds for surface-Mount Devices"; pp. 1023-1029.

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