Epoxy resin coating compositions for printed circuit boards

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Processes of preparing a desired or intentional composition...

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Details

428901, 523428, 523434, 523437, 523438, 525113, 525504, 525523, 525476, C08L 6300, C08L 6310

Patent

active

045102767

ABSTRACT:
A resinous protective coating useful in adhering plastics to metallic substrates. The protective coating is particularly useful as a solder mask and in the manufacture of printed circuit boards with circuit patterns having a resolution of at least 0.25 mm lines and spaces thereon. The protective coating comprises resins dissolved in solvents, wherein the coating, upon being subjected to heat, goes from a liquid or soft "gel-like" state into a solid phase without bleeding. The protective coating is resistant to copper, nickel and gold electroplating baths, adheres to insulating substrates, adhesive coated base materials as well as metallic substrates and is capable of withstanding the thermal shock of dip soldering.

REFERENCES:
patent: 3374186 (1968-03-01), Steden et al.
patent: 3519602 (1970-07-01), Castro et al.
patent: 3816364 (1974-06-01), Bayer
patent: 3864426 (1975-02-01), Salensky
patent: 3926904 (1975-12-01), Scola
patent: 4240945 (1980-12-01), Gabrick

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