Epoxy resin-based composition for encapsulation of semiconductor

Details Epoxy resin-based composition for encapsulation of semiconductor Epoxy resin-based composition for encapsulation of semiconductor

1986-05-21

1987-10-20

Jacobs, Lewis T.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Processes of preparing a desired or intentional composition...

523443, 523466, C08K 700, C08K 336

Patent

active

047014792

ABSTRACT:
The inorganic filler in the inventive epoxy resin-based composition is a combination of two kinds of quartz powder of which one is a quartz powder having a spherical particle form and the other is a pulverized quartz powder in a specified proportion. The resin composition is highly flowable and capable of giving encapsulation of semiconductor devices with little fins having outstandingly small thermal expansion coefficient and highly resistant against crack formation.

REFERENCES:
patent: 2866112 (1958-12-01), Matz
patent: 3637572 (1972-01-01), Ogata et al.
patent: 4271061 (1981-06-01), Suzuki et al.
patent: 4293479 (1981-10-01), Hanada et al.
patent: 4615741 (1986-10-01), Kobayashi et al.

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