Epoxy resin and adhesive composition containing the same

Details Epoxy resin and adhesive composition containing the same Epoxy resin and adhesive composition containing the same

1991-04-19

1993-11-02

Dean, Jr., Ralph H.

Compositions

Electrically conductive or emissive compositions

Free metal containing

252500, 523435, 523458, 525487, 528 27, 528 29, 549214, 549215, H01B 102

Patent

active

052581390

ABSTRACT:
An adhesive composition comprising (a) an epoxy resin obtained by reacting a 1,3-bis(dicarboxyphenyl)-1,1,3,3-tetrasubustituted disiloxane dianhydride with an alcohol or alcohol derivative, followed by reaction with an epoxy compound having two or more epoxy groups, or an epoxy resin obtained by reacting a 1,3-bis(dicarboxyphenyl)-1,1,3,3-tetrasubstituted disiloxane with an epoxy compound having two or more epoxy groups and (b) a curing agent is suitable for bonding semiconductor chips to a copper frame with a small warpage of the chips.

REFERENCES:
patent: 4652398 (1987-03-01), Goswami et al.
patent: 4692272 (1987-09-01), Goswami et al.
patent: 4794153 (1988-12-01), Rich
patent: 4826916 (1989-05-01), Policastro et al.
patent: 4874548 (1989-10-01), Hajovsky
patent: 5015700 (1991-05-01), Herzig et al.

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