Epoxy resin

Dynamic information storage or retrieval – Specific detail of information handling portion of system – Mechanical modification or sensing of storage medium

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Details

369132, G11B 344

Patent

active

044882831

ABSTRACT:
An epoxy composition derived from tetraglycidated methylene dianiline cured with a methylated maleic acid adduct of phthalic anhydride has a high glass-transition temperature and a low curing temperature and when cured has very high bond strength. This epoxy can be used to bond a diamond cutterhead stylus to a piezoelectric element.

REFERENCES:
patent: 4035590 (1977-07-01), Halter
Ciba-Geigy, "Araldite MY 720," Resins Dept., Ciba-Geigy Corporation, Ardsley, New York 10502.
EPON Resin Structural Reference Manual, Shell Chemical Company.
Lee et al.; Handbook of Epoxy Resins; McGraw-Hill Book Co.; 1967; pp. 12-9, 12-10, 14-30, Sci. Lib.

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