Epoxy/polyimide copolymer blend dielectric and layered circuits

Details Epoxy/polyimide copolymer blend dielectric and layered circuits Epoxy/polyimide copolymer blend dielectric and layered circuits

1991-01-28

1992-04-28

Ryan, Patrick J.

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

428413, 4284735, 428901, B32B 900

Patent

active

051088258

ABSTRACT:
A copolymer blend of epoxy and polyimide is used as a dielectric layer in a multilayer interconnect structure. This copolymer blend is free of cracking and crazing, provides good interlayer adhesion and following fabrication, is stable at temperatures in excess of 200.degree. C. A preferred composition is a siloxane polyimide in combination with a cycloalaphatic epoxy.

REFERENCES:
patent: 3856752 (1974-12-01), Bateman et al.
patent: 4480009 (1984-10-01), Berger
patent: 4557860 (1985-12-01), DiSalvo et al.
patent: 4692272 (1987-09-01), Gaswami et al.
patent: 4783695 (1988-11-01), Eichelberger et al.
patent: 4824716 (1989-04-01), Yerman
patent: 4931539 (1990-06-01), Hayes
Lee and Neville, Handbook of Epoxy Resins, McGraw-Hill Book Company, New York (1967), pp. 11:11-12.

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