Epoxy molding compounds with resistance to UV light and heat

Details Epoxy molding compounds with resistance to UV light and heat Epoxy molding compounds with resistance to UV light and heat

2006-10-24

2006-10-24

Sellers, Robert (Department: 1712)

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Processes of preparing a desired or intentional composition...

C523S453000, C523S455000, C523S459000, C525S508000, C525S533000

Reexamination Certificate

active

07125917

ABSTRACT:
A molding compound is provided for use in encapsulating electronic packages which include an optoelectronic component, such as an LED. The molding compound includes a partially cured epoxy composition, an antioxidant, and, optionally, a phosphor material substantially uniformly distributed throughout the epoxy composition. The optional phosphor material may be suspended within the epoxy composition by pre-reacting a portion of the epoxy composition prior to B-staging of the molding compound. As such, the optional phosphor material is suspended within the epoxy composition, thereby preventing settling of the phosphor material during B-staging, as well as during curing of the molding compound in the encapsulation process.

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