Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Processes of preparing a desired or intentional composition...
Reexamination Certificate
2006-01-24
2006-01-24
Sellers, Robert (Department: 1712)
Synthetic resins or natural rubbers -- part of the class 520 ser
Synthetic resins
Processes of preparing a desired or intentional composition...
C523S459000, C525S508000, C525S533000
Reexamination Certificate
active
06989412
ABSTRACT:
A molding compound for use in encapsulating electronic packages which include an optoelectronic component, such as an LED, is provided. The molding compound of the present invention includes a partially cured epoxy composition having a phosphor material substantially uniformly distributed throughout the epoxy composition. The phosphor material may be suspended within the epoxy composition by pre-reacting a portion of the epoxy composition prior to B-staging of the molding compound. As such, the phosphor material is suspended within the epoxy composition, thereby preventing settling of the phosphor material during B-staging, as well as during curing of the molding compound in the encapsulation process.
REFERENCES:
patent: 3849383 (1974-11-01), Fetscher et al.
patent: 4288264 (1981-09-01), Haque
patent: 4298650 (1981-11-01), Lu
patent: 4362946 (1982-12-01), Cusano et al.
patent: 4485200 (1984-11-01), Perlinski et al.
patent: 4532395 (1985-07-01), Zukowski
patent: 4534743 (1985-08-01), D'Onofrio et al.
patent: 4551488 (1985-11-01), Leech et al.
patent: 4814227 (1989-03-01), Maeda et al.
patent: 4900641 (1990-02-01), Kohda et al.
patent: 4943606 (1990-07-01), Inoue et al.
patent: 5076963 (1991-12-01), Kameyama et al.
patent: 5149971 (1992-09-01), McElhaney et al.
patent: 5454892 (1995-10-01), Kardon et al.
patent: 5521236 (1996-05-01), Moy et al.
patent: 5624979 (1997-04-01), Kleiner et al.
patent: 5646412 (1997-07-01), Bryan et al.
patent: 5813753 (1998-09-01), Vriens et al.
patent: 5886401 (1999-03-01), Liu
patent: 5956382 (1999-09-01), Wiener-Avnear et al.
patent: 5973034 (1999-10-01), Mori et al.
patent: 6245259 (2001-06-01), Hohn et al.
patent: 6246123 (2001-06-01), Landers et al.
patent: 6376101 (2002-04-01), Ota
patent: 6396066 (2002-05-01), Chen et al.
patent: 6501102 (2002-12-01), Mueller-Mach et al.
patent: 6518600 (2003-02-01), Shaddock
patent: 6555023 (2003-04-01), Smith
patent: 6592780 (2003-07-01), Höhn et al.
patent: 6593011 (2003-07-01), Liu et al.
patent: 6603258 (2003-08-01), Mueller-Mach et al.
patent: 6603259 (2003-08-01), Kiryuschev et al.
patent: 6613247 (2003-09-01), Höhn et al.
patent: 6617401 (2003-09-01), Rubinsztajn
patent: 6632892 (2003-10-01), Rubinsztajn et al.
patent: 6713571 (2004-03-01), Shimada
patent: 2001/0028053 (2001-10-01), Hohn et al.
patent: 2001/0030326 (2001-10-01), Reeh et al.
patent: 2001/0046601 (2001-11-01), Peruzzotti et al.
patent: 2003/0001140 (2003-01-01), Starkey
patent: 2003/0071568 (2003-04-01), Lowery et al.
patent: 2003/0099859 (2003-05-01), Liu et al.
patent: 2003/0173540 (2003-09-01), Mortz et al.
patent: 2003/0178632 (2003-09-01), Hohn et al.
patent: 2004/0063840 (2004-04-01), Starkey
patent: 52015539 (1977-05-01), None
patent: 63100391 (1988-09-01), None
Derwent accession No. 1977-19192Y for Japanese Patent No. 52-15539, Feb. 5, 1977, Nakano.
Bauman Steven C.
Henkel Corporation
Sellers Robert
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