Epoxy-modified polyamide resin

Details Epoxy-modified polyamide resin Epoxy-modified polyamide resin

1994-07-15

1999-02-23

Hampton-Hightower, P.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

From carboxylic acid or derivative thereof

528 49, 528 59, 528272, 528274, 528296, 528322, 528332, 528335, 528336, 525418, 525419, 525423, C08G 7310

Patent

active

058745181

ABSTRACT:
An epoxy-modified polyamide resin obtained by reacting a diisocyanate(A) with at least one member selected from the group consisting of a dicarboxylic acid and a tricarboxylic acid anhydride (B) in a nitrogen-containing aprotic solvent to form a polyamide resin intermediate and reacting this polyamide resin intermediate with an epoxy resin (C) in the nitrogen-containing aprotic solvent. This epoxy-modified polyamide resin has a high molecular weight and can provide a film with excellent heat resistance and flexibility, and its composition can be used as a coating material, adhesive or such in the form as it is.

REFERENCES:
patent: 5095058 (1992-03-01), Smith et al.
Chemical Abstracts, vol. 116, No. 4, 27 Jan. 1992, Columbus, Ohio, US; Abstract No. 22449.
Chemical Abstracts, vol. 110, No. 18, 1 May 1989, Columbus, Ohio, US; Abstract No. 155790.
Database WPI, Week 8910, Derwent Publications Ltd. London, GB AN 89-072683.
Patent Abstracts of Japan, vol. 17, No. 361 (C-1080), 8 Jul. 1993.

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