Epoxy group-containing copolymer and radiation sensitive resin c

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Compositions to be polymerized by wave energy wherein said...

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Details

522114, 522120, 522121, 522116, 522122, C08F 250, C08L 3314, C08K 504, C08K 506

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active

055300367

ABSTRACT:
An epoxy group-containing thermosetting resin composition comprising (A) a copolymer obtained From (a) at least one member selected from an unsaturated carboxylic acid and an unsaturated carboxylic acid anhydride, (b) an epoxy group-containing unsaturated compound, (c) a monoolefin unsaturated compound, and optionally (d) a conjugated diolefin unsaturated compound, and (B) an organic solvent for dissolving the above copolymer. There is also provided another epoxy-group containing thermosetting resin composition which contains the above component (A), (C) a polymerizable compound having at least one ethylenically unsaturated double bond, and (D) a photopolymerization initiator. These epoxy-group containing thermosetting resin compositions are excellent in storage stability.

REFERENCES:
patent: 4299911 (1981-11-01), Ochi et al.
patent: 4312916 (1982-01-01), Kakumaru et al.
patent: 4963617 (1990-10-01), Fourquier et al.
patent: 5147759 (1992-09-01), Ohtawa et al.
patent: 5362597 (1994-11-01), Sano et al.

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