Epoxy encapsulating formulation

Details Epoxy encapsulating formulation Epoxy encapsulating formulation

1982-06-24

1983-08-30

Jacobs, Lewis T.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Processes of preparing a desired or intentional composition...

524404, 524427, 524428, 525524, C08L 6300

Patent

active

044017758

ABSTRACT:
Epoxy resin compositions are disclosed which have an exceptional capacity to penetrate tightly wound wire bundles such as tertiary coils in high voltage flyback transformers. The subject compositions are therefore useful for encapsulating such coils.

REFERENCES:
patent: 2768153 (1956-10-01), Shokal
patent: 2890195 (1959-06-01), Phillips et al.
patent: 2967843 (1961-01-01), Delmonte et al.
patent: 3247283 (1966-04-01), McGary et al.
patent: 3296332 (1967-01-01), Chase et al.
patent: 3578633 (1971-05-01), Rossa
patent: 3689444 (1972-09-01), Wolfe
patent: 4137275 (1979-01-01), Smith et al.
Lee and Neville, Handbook of Epoxy Resins, McGraw-Hill, 1967, pp. 17-7 to 17-42.
May and Tanaka, Epoxy Resins, Chemistry and Technology, Marcel Dekker, Inc. 1973, pp. 487-512 and 579-582 from a chapter by A. J. Breslau entitled, "Electrical and Electronic Application".

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