Epoxy compound and cured epoxy resin product

Organic compounds -- part of the class 532-570 series – Organic compounds – Four or more ring nitrogens in the bicyclo ring system

Reexamination Certificate

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Details

C544S239000, C546S281700, C546S296000, C549S560000, C525S507000, C525S122000, C525S523000, C525S533000

Reexamination Certificate

active

10560891

ABSTRACT:
The present invention provides a novel epoxy compound, which can be converted into a cured epoxy resin product having liquid crystal properties by curing with a curing agent. Since the cured epoxy resin product of the present invention exhibits good heat conductivity, it is also useful as an insulating material requiring high heat releasability such as a printed circuit substrate and the like.

REFERENCES:
patent: 5569727 (1996-10-01), Mormann et al.
patent: 5851427 (1998-12-01), Kelly
patent: 5904984 (1999-05-01), Smith et al.
patent: 2 338 240 (1999-12-01), None
patent: 63006015 (1988-01-01), None
Broer, D. J.; Lub, J., and Mol, G. N. “Synthesis and Photopolymerization of a Liquid-Crystalline Diepoxide” Macromolecules 1993, 26, 1244-1247.
Mallon, Joseph J.; Adams, Paul M. “Synthesis and characterization of novel epoxy monomers and liquid crystal thermosets.” Journal of Polymer Science, Part A: Polymer Chemistry 1993, 31(9), 2249-60.
Kostromin, S. G.; Tuan, Pham Anh; Shibaev, V.P. “Liquid crystal poly(a-oxiranes) with mesogenic side group.” Vysokomolekulyarnye Soedineniya, Seriya A i Seriya B 1994, 36(11), 1807-16 (abstract only).
N. Baraskov et al., “Design of New Polymers to Improve Radiation Stability of Plastic Scintillators”, Proceedings of the Fourth International Conference on Calorimetry in High Energy Physics, pp. 542-551, XP009037802, 1993.

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