Epoxy compositions, and method of making same

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Processes of preparing a desired or intentional composition...

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523440, 523443, 523457, 524906, 427386, C08K 336, C08K 326, B05D 302

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active

049239082

ABSTRACT:
An epoxy resin composition, especially useful as an encapsulant and exhibiting a low dissipation factor, is prepared from a first component comprising an epoxy of a polyglycidal ether of a polyhydroxyl phenol and filler, and a second component comprising a cycloaliphatic acid anhydride curing agent, filler and catalyst. Each component is mixed separately under high shear, and the filler for each component comprises at least about 50 percent by weight. The two components are admixed, applied as an encapsulant, and cured at an elevated temperature.

REFERENCES:
patent: 4042550 (1977-08-01), Tuller et al.
patent: 4104238 (1978-08-01), Chenoweth et al.
patent: 4145369 (1979-03-01), Hira et al.
patent: 4617330 (1986-10-01), Thai et al.
patent: 4665111 (1987-05-01), Hussain et al.

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