Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Processes of preparing a desired or intentional composition...
Reexamination Certificate
2011-04-12
2011-04-12
Feely, Michael J (Department: 1761)
Synthetic resins or natural rubbers -- part of the class 520 ser
Synthetic resins
Processes of preparing a desired or intentional composition...
C428S413000
Reexamination Certificate
active
07923488
ABSTRACT:
An epoxy composition for applications such as one-part adhesives, coatings, prepreg and molding compounds that includes leuco dyes, particularly those comprising a N,N-dialkylamino-, N,N-diarylamino-, N-alkyl-N-arylamino-, N-alkylamino- or N-arylamino- functional group on one of the aromatic rings, as a co- catalyst or co-curing agent. The use of the leuco dye co-catalyst provides improved curing speed of the epoxy composition comprising a latent curing agent/catalyst such as imidazole microcapsules while maintaining the shelf-life stability. The epoxy may also include a secondary co-catalyst that includes a urea, particularly those comprising a N,N-dialkylamino-, N,N-diarylamino-, N-alkyl-N-arylamino- or dicycloalkylamino- functional group. Secondary cocatalysts of low mobility at the storage conditions are particularly preferred. The improved epoxy composition is implemented as adhesives for manufacturing an anisotropic conductive film (ACF) and also for connecting, encapsulating, or packaging of electronic devices.
REFERENCES:
patent: 4247234 (1981-01-01), Hoffman
patent: 4606962 (1986-08-01), Reylek
patent: 4696764 (1987-09-01), Yamazaki
patent: 4740657 (1988-04-01), Tsukagoshi et al.
patent: 4877761 (1989-10-01), Chmiel et al.
patent: 5087494 (1992-02-01), Calhoun et al.
patent: 5136359 (1992-08-01), Takayama et al.
patent: 5141790 (1992-08-01), Calhoun et al.
patent: 5162087 (1992-11-01), Fukuzawa
patent: 5163837 (1992-11-01), Rowlette, Sr.
patent: 5216065 (1993-06-01), Colyer et al.
patent: 5219462 (1993-06-01), Bruxvoort et al.
patent: 5275856 (1994-01-01), Calhoun et al.
patent: 5300340 (1994-04-01), Calhoun et al.
patent: 5366140 (1994-11-01), Koskenmaki et al.
patent: 5437754 (1995-08-01), Calhoun et al.
patent: 5438223 (1995-08-01), Higashi et al.
patent: 5486427 (1996-01-01), Koskenmaki et al.
patent: 5522962 (1996-06-01), Koskenmaki et al.
patent: 5533447 (1996-07-01), Johnson et al.
patent: 5589523 (1996-12-01), Sawaoka et al.
patent: 5613862 (1997-03-01), Naylor
patent: 5672400 (1997-09-01), Hansen et al.
patent: 5769996 (1998-06-01), Mcardle et al.
patent: 5820450 (1998-10-01), Calhoun et al.
patent: 5839188 (1998-11-01), Pommer
patent: 5851644 (1998-12-01), Mcardle
patent: 5882802 (1999-03-01), Ostoiski
patent: 5916641 (1999-06-01), Mcardle et al.
patent: 6011307 (2000-01-01), Jiang et al.
patent: 6042894 (2000-03-01), Goto et al.
patent: 6120489 (2000-09-01), Johnson et al.
patent: 6180226 (2001-01-01), Mcardle et al.
patent: 6214460 (2001-04-01), Bluem et al.
patent: 6274508 (2001-08-01), Jacobson et al.
patent: 6281038 (2001-08-01), Jacobson et al.
patent: 6352775 (2002-03-01), Sasaki et al.
patent: 6402876 (2002-06-01), Mcardle et al.
patent: 6423172 (2002-07-01), Mcardle et al.
patent: 6555408 (2003-04-01), Jacobson et al.
patent: 6566744 (2003-05-01), Gengel
patent: 6632532 (2003-10-01), Yamada et al.
patent: 6672921 (2004-01-01), Liang et al.
patent: 6683663 (2004-01-01), Hadley et al.
patent: 6751008 (2004-06-01), Liang et al.
patent: 6770369 (2004-08-01), Oyamada et al.
patent: 6784953 (2004-08-01), Liang et al.
patent: 6788452 (2004-09-01), Liang et al.
patent: 6833943 (2004-12-01), Liang et al.
patent: 6834612 (2004-12-01), Chambers et al.
patent: 6884833 (2005-04-01), Chheang et al.
patent: 6906427 (2005-06-01), Tanaka et al.
patent: 2001/0008169 (2001-07-01), Connell et al.
patent: 2002/0140093 (2002-10-01), Yamazaki et al.
patent: 2006/0054867 (2006-03-01), Yamada
patent: 2007/0191520 (2007-08-01), Sugiki et al.
patent: 2008/0191174 (2008-08-01), Ehrensvard et al.
patent: 1168373 (2006-01-01), None
patent: 61074205 (1986-04-01), None
patent: 07173667 (1995-07-01), None
patent: 2005-226014 (2005-08-01), None
patent: WO 00/00563 (2000-01-01), None
patent: WO 2005/100472 (2005-10-01), None
patent: WO 2007130127 (2007-11-01), None
patent: WO 2007130137 (2007-11-01), None
Machine translation of JP 2005-226014 A, provided by the JPO website (no date).
Asai, et al., Development of an Anistropic Conductive Adhesive Film (ACF) from Epoxy Resins, Journal of Applied Polymer Science, pp. 769-777, John Wiley and Sons, Inc. (No Date).
Dokoutchaev, A., et al., “Colloidal Metal Deposition onto Functionalized Plystyrene Microspheres,” Chem Matter, 1999, 11, pp. 2389-2399, American Chemical Society.
Gengel, “A Process for the Manufacture of Cost Competitive MCM Substrates,” MCM '94, 1992,pp. 182-187.
Ishibashi, et al., “A New Anisotropic Conductive Particles” IEEE Transactions on Components, Packaging, and Manufacturing Technology—Part B, vol. 19, No. 4 Nov. 1996, pp. 752-757.
Mescher, et al., “Application Specific Flip Chip Packages; Consideration and Options in Using FCIP,” Pan Pacific Microelectronics Syposium Conference, Jan. 2000.
Search Report for PCT/US2006/042229 (published as WO 2007/130127 A3) (2008).
Ugelstad, et al., “Biomedical Applications of Monodisperse Magnetic Polymer Particles,” Future Directions in Polymer Colloids (1987), p. 355, El-sser and Fitch (ed.) Martinus Nijhoff (pub).
Ugelstad, et al., “Preparation and Application of Monodisperse Polymer Particles,” Journal of Polymer Science 72, (1985), pp. 225-240.
Ugelstad, et al., Swelling of Olgiomer-Polymer Particles, New Methods of Preparation of Emulsion and Polymer Disperson; Advances in Colloid and Interface Science, 13, (1980), pp. 101-140, Elsevier Scientific Publishing Company, Amsterdam.
Yamaguchi, et al., “Cupil-T Anisotropic Conductive Film for Testing,” Nitto Giho, vol. 40, Sep. 2002, pp. 17-20.
Search Report for PCT/US2006/046807 (published as WO 2007/130137 A3) (2009).
Hou Chung-Jen
Liang Rong-Chang
Xu Qianfei
Feely Michael J
Thompson Hine LLP
Trillion Science, Inc.
LandOfFree
Epoxy compositions does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Epoxy compositions, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Epoxy compositions will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2652109