Stock material or miscellaneous articles – Structurally defined web or sheet – Physical dimension specified
Patent
1990-03-14
1990-10-02
Jacobs, Lewis T.
Stock material or miscellaneous articles
Structurally defined web or sheet
Physical dimension specified
427386, 428209, 523428, 523454, 523459, B32B 700, C08K 322, B05D 302
Patent
active
049606344
ABSTRACT:
A composition of enhanced thermal conductivity which comprises a tetrabrominated diglycidyl ether polyepoxide; and epoxy polymer having an epoxy functionality of 3.5 to 6; zinc oxide and curing agents; and use thereof.
REFERENCES:
patent: 3492535 (1970-01-01), Behrendt
patent: 3523037 (1970-08-01), Chellis
patent: 3527720 (1970-09-01), Groff
patent: 3641195 (1972-02-01), Ball et al.
patent: 3763087 (1973-10-01), Holub et al.
patent: 3801427 (1974-04-01), Morishita et al.
patent: 3898422 (1975-08-01), Fuller et al.
patent: 3908040 (1975-09-01), Dauksys
patent: 3928668 (1975-12-01), Snow
patent: 3972821 (1976-08-01), Weidenbenner et al.
patent: 4018944 (1977-04-01), Hallstrom et al.
patent: 4092487 (1978-05-01), Imai
patent: 4092697 (1978-05-01), Spaight
patent: 4145327 (1979-03-01), Dolch et al.
patent: 4159221 (1979-06-01), Schuessler
patent: 4175152 (1979-11-01), Carnahan et al.
patent: 4233620 (1980-11-01), Darrow et al.
patent: 4265775 (1981-05-01), Aakalu et al.
patent: 4268337 (1981-05-01), Ibata et al.
patent: 4371579 (1983-02-01), McCaskey et al.
patent: 4372347 (1983-02-01), Olson
patent: 4546410 (1985-10-01), Kaufman
patent: 4574879 (1986-03-01), DeGree et al.
patent: 4581158 (1986-04-01), Lin
patent: 4593052 (1986-06-01), Irving
patent: 4596840 (1986-06-01), Hesse et al.
patent: 4601916 (1986-07-01), Arachtingi
patent: 4642321 (1987-02-01), Schoenberg et al.
patent: 4647402 (1987-03-01), Tamura
patent: 4661301 (1987-04-01), Okada et al.
patent: 4685987 (1987-08-01), Fick
patent: 4689110 (1987-08-01), Leibowitz
patent: 4725650 (1988-02-01), Landi et al.
patent: 4730666 (1988-03-01), Flint et al.
patent: 4740425 (1988-04-01), Leland et al.
patent: 4803115 (1989-02-01), Fushiki et al.
patent: 4810563 (1989-03-01), DeGree et al.
patent: 4849856 (1989-07-01), Funari et al.
"Handbook of Fillers for Plastics", Katz et al., Van Nostrand Reinhold Co., 1987, Section 2.2.7 and Table 12-1.
"Technology of Paints, Varnishes and Lacquers", pp. 354-355.
Wong, "Heat Sink Encapsulant", IBM Technical Disclosure Bulletin, vol. 9, No. 3, Aug. 1966, p. 224.
Electronics Products Magazine, Jul. 1968, Epoxies for Packaging.
Doo et al., "Method of Effective Cooling of a High Power Silicon Chip", IBM Technical Disclosure Bulletin, vol. 20, No. 4, Sep. 1977, pp. 1436 and 1437.
Yeh, "Bump Internal-Thermal Enhancement", IBM Technical Disclosure Bulletin, vol. 27, No. 7B, Dec. 1984, pp. 4413-4415.
Buller et al., "Module Process Compatible Thermally Ehanced Fin Attach Process", IBM Technical Disclosure Bulletin, vol. 24, No. 1B, Jun. 1981, p. 863.
Irish et al., "Enhanced Adhesion and Thermal Conductivity of Epoxy Sealant", IBM Technical Disclosure Bulletin, vol. 28, No. 11, Apr. 1986, p. 4710.
Materials Selector, Mid-Sep. 1973, pp. 17 et seq.
Tuckerman, "Heat-Transfer Microstructures for Integrated Circuits", Lawrence Livermore National Laboratory, University of California, Feb. 1984.
Boyko Christina M.
Johnston Craig N.
Loomis James R.
Samuelson Carl E.
Schumacher Ricahrd A.
International Business Machines - Corporation
Jacobs Lewis T.
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