Epoxy composition for encasing semiconductor devices

Details Epoxy composition for encasing semiconductor devices Epoxy composition for encasing semiconductor devices

1975-10-15

1977-03-22

Jacobs, Lewis T.

Chemistry of carbon compounds

Miscellaneous organic carbon compounds

260 59EP, C08L 6304

Patent

active

040136124

ABSTRACT:
An epoxy resin composition for encasing semiconductive devices comprising a homogeneous mixture of a cresol novolak type epoxy resin and phthalic anhydride as a curing agent, the amount of phthalic anhydride being in excess of the equivalents of epoxide groups, a derivative of imidazole as a curing accelerating agent, and remainder being mineral filler.

REFERENCES:
patent: 3394105 (1968-07-01), Christie
patent: 3507831 (1970-04-01), Avis et al.
patent: 3838094 (1974-09-01), Sporck

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