Epoxy composition and use thereof

Details Epoxy composition and use thereof Epoxy composition and use thereof

1988-11-04

1991-07-02

James, Andrew J.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

At least one aryl ring which is part of a fused or bridged...

357 81, 524 80, 528110, H01L 2328

Patent

active

050289845

ABSTRACT:
A curable composition containing an epoxide component and zinc oxide and use thereof.

REFERENCES:
patent: 3492535 (1970-01-01), Behrendt
patent: 3527720 (1970-09-01), Groff
patent: 3641195 (1972-02-01), Ball et al.
patent: 3763087 (1973-10-01), Holub et al.
patent: 3801427 (1974-04-01), Morishita et al.
patent: 3898422 (1975-08-01), Fuller et al.
patent: 3908040 (1975-09-01), Dauksys
patent: 3928668 (1975-12-01), Snow
patent: 3972821 (1976-08-01), Weidenbenner et al.
patent: 4018944 (1977-04-01), Hallstrom
patent: 4092487 (1978-05-01), Imai
patent: 4092697 (1978-05-01), Spaight
patent: 4145327 (1979-03-01), Dolch et al.
patent: 4159221 (1979-06-01), Schuessler
patent: 4175152 (1979-11-01), Carnahan et al.
patent: 4233620 (1980-11-01), Darrow et al.
patent: 4233645 (1980-11-01), Balderes et al.
patent: 4265775 (1981-05-01), Aakalu et al.
patent: 4268337 (1981-05-01), Ibata et al.
patent: 4371579 (1983-02-01), McCaskey et al.
patent: 4372347 (1983-02-01), Olson
patent: 4410647 (1983-10-01), Susko et al.
patent: 4546410 (1985-10-01), Kaufman
patent: 4555533 (1985-11-01), Ambros et al.
patent: 4574879 (1986-03-01), DeGree et al.
patent: 4581158 (1986-04-01), Lin
patent: 4593052 (1986-06-01), Irving
patent: 4596840 (1986-06-01), Hesse et al.
patent: 4601916 (1986-07-01), Arachtingi
patent: 4642321 (1987-02-01), Schoenberg et al.
patent: 4647402 (1987-03-01), Tamura
patent: 4661304 (1987-04-01), Okada et al.
patent: 4678831 (1987-07-01), Kawabata et al.
patent: 4685987 (1987-08-01), Fick
patent: 4689110 (1987-08-01), Leibowitz
patent: 4725650 (1988-02-01), Landi et al.
patent: 4740425 (1988-04-01), Leland et al.
patent: 4849856 (1989-07-01), Funari et al.
Yeh, "Bump Internal-Thermal Enchancement", IBM Technical Disclosure Bulletin, vol. 27, No. 7B, Dec. 1984, pp. 4413-4415.
Buller et al., "Module Process Compatible Thermally Enhanced Fin Attach Process", IBM Technical Disclosure Bulletin, vol. 24, No. 1B, Jun. 1981, p. 863.
Irish et al., "Enhanced Adhesion and Thermal Conductivity of Epoxy Sealant", IBM Technical Disclosure Bulletin, vol. 28, No. 11, Apr. 1986, p. 4710.
Electronics Products Magazine, Jul. 1968, Epoxies for Packaging.
Doo et al., "Method of Effective Cooling of a High Power Silicon Chip", IBM Technical Disclosure Bulletin, vol. 20, No. 4, Sep. 1977, pp. 1436 and 1437.
Materials Selector, Mid-Sep. 1973, pp. 17 et seq.
"Handbook of Fillers for Plastics", Katz et al., Van Nostrand Reinhold Company, 1987, Section 2.2.7 and Table 12-1.
"Technology of Paints, Varnishes and Lacquers", pp. 354-355.
"Zinc Oxide Properties and Applications", International Lead Zinc Research Organization, New York, Chapter 5, p. 3.
Tuckerman, "Heat-Transfer Microstructures for Integrated Circuits", Lawrence Livermore National Laboratory, University of California, Feb. 1984.

Affiliated with

Also associated with

Rating

Epoxy composition and use thereof does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Epoxy composition and use thereof, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Epoxy composition and use thereof will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1251208