Epoxy composition and sealing of integrated circuit modules ther

Details Epoxy composition and sealing of integrated circuit modules ther Epoxy composition and sealing of integrated circuit modules ther

1980-11-28

1983-10-18

Ziegler, J.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Processes of preparing a desired or intentional composition...

525493, C08K 334, C08K 545

Patent

active

044106475

ABSTRACT:
A composition containing an epoxy polymer, 4,4'(2-acetoxy-1,3 glyceryl)bis anhydro trimellitate; a polyanhydride; and a solid filler; method of preparation, and the sealing of integrated circuit modules therewith are provided.

REFERENCES:
patent: 3845016 (1974-10-01), Labana et al.
patent: 4034014 (1977-07-01), Curtis, Jr. et al.
patent: 4233620 (1980-11-01), Darrow et al.
patent: 4292230 (1981-09-01), Kenney et al.
IBM Technical Disclosure Bulletin, vol. 22, No. 10, 3-80, p. 4467, "Curing Agent not Subject to Hydrolysis", Gleason et al.

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