Epoxy composition and its use as an adhesive

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

Patent

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Details

260 2EC, 260 2N, 260 18EP, 260 332EP, 260 47EC, 260 47EN, 260 59EP, 260 4595G, 260 7841, C08G 5918

Patent

active

040070794

ABSTRACT:
An improved epoxy resin composition is disclosed which incorporates a select group of chlorine-containing polyols. The improved composition is used as an adhesive and in various other applications.

REFERENCES:
patent: 3269961 (1966-08-01), Bruson et al.
patent: 3496120 (1970-02-01), Davis et al.

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