Epoxy bond and stop etch fabrication method

Details Epoxy bond and stop etch fabrication method Epoxy bond and stop etch fabrication method

1998-04-23

2000-08-29

Wood, Elizabeth

Etching a substrate: processes

Adhesive or autogenous bonding of two or more...

Removing at least one of the self-sustaining preforms or a...

216 33, 216 52, 438751, 438753, 20419235, B44C 122, H01L 21461

Patent

active

061103934

ABSTRACT:
A class of epoxy bond and stop etch (EBASE) microelectronic fabrication techniques is disclosed. The essence of such techniques is to grow circuit components on top of a stop etch layer grown on a first substrate. The first substrate and a host substrate are then bonded together so that the circuit components are attached to the host substrate by the bonding agent. The first substrate is then removed, e.g., by a chemical or physical etching process to which the stop etch layer is resistant. EBASE fabrication methods allow access to regions of a device structure which are usually blocked by the presence of a substrate, and are of particular utility in the fabrication of ultrafast electronic and optoelectronic devices and circuits.

REFERENCES:
patent: 2747977 (1956-05-01), Eisler
patent: 5116459 (1992-05-01), Kordus et al.

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