Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Processes of preparing a desired or intentional composition...
Reexamination Certificate
1999-03-18
2001-03-27
Dawson, Robert (Department: 1712)
Synthetic resins or natural rubbers -- part of the class 520 ser
Synthetic resins
Processes of preparing a desired or intentional composition...
C523S440000, C523S443000, C525S107000, C525S113000, C525S121000, C525S132000
Reexamination Certificate
active
06207730
ABSTRACT:
TECHNICAL FIELD
This invention relates to an adhesive composition especially suitable for securing a flexible, porous substrate to a more rigid substrate. The adhesive composition is made by adding microspheres to both the A- and B-sides of an epoxy composition.
BACKGROUND OF THE INVENTION
Epoxy adhesives are well-known in the art. These epoxy adhesives have many uses, including the bonding of substrates of various kinds. Epoxies are generally made by a combination of a so-called A-side epoxy and a so-called B-side epoxy.
One known use of an epoxy is to secure a vinyl sheet or film to a particle board. The combination of the vinyl sheet or film and the particle board, luaun or medium density fiberboard creates an aesthetically pleasing, solid structure that can be used in a variety of applications, as for example as a decorative element in the interiors of either pre-fabricated homes or motor homes.
The use of epoxy on such vinyl sheet/particle board composite structures has generally proven to be effective, when those vinyl sheets are smooth and non-porous. However, problems have arisen when epoxy is used to secure an embossed vinyl onto particle boards.
This is because the embossing process creates tiny holes that pass from the front side to the back side of the vinyl. These holes may be imperceptible to the eye, but are sufficiently large to permit the passage of the epoxy. Thus, when the vinyl is secured to the particle board with the epoxy, the epoxy passes through these tiny holes. This can damage the aesthetic appearance of the vinyl.
In addition, after the epoxy is used to adhere the vinyl to the particle board, the composite structure must dry. In order to dry, the composite structures are stacked upon each other. When the epoxy seeps through the vinyl of one of the composite structures, that epoxy wets the particle board of an adjacent composite structure. A day later, when one attempts to separate the respective composite structures, the epoxy has cured, and the vinyl of the first structure is adhered to the particle board of the adjacent structure. This prevents the “clean” separation of the adjacent composite structures, and can result in damage to those structures when one attempts their separation.
Thus, there is a need for an adhesive that will prevent the problems created by prior art epoxies.
SUMMARY OF THE INVENTION
The invention is an adhesive composition, which comprises an A- or B-side epoxy, and further includes a plurality of microspheres blended into either the A-side epoxy alone, the B-side epoxy alone, or into both. The microspheres of the invention are preferably made of a thermoplastic shell.
Preferably, the microspheres are made of an acrylonitrile copolymer, and have a weight average diameter of between 60 and 90 microns. Most preferably, the microspheres are dry, expanded microspheres.
As a result of the use of this adhesive between the two substrates, a thin, strong bond is formed. The first of these two adhered substrates may include relatively small holes whose size is nevertheless sufficient to cause some problems, if a conventional epoxy were used. Specifically, the holes in this first substrate would normally be subject to unacceptable levels of liquid seepage if a liquid epoxy adhesive were used to bond those substrates. The bond is formed by a combination of an epoxy and a plurality of microspheres. This epoxy and microsphere combination substantially inhibits seepage of the epoxy through any holes in the first substrate.
DETAILED DESCRIPTION
This invention may include many different embodiments. Preferred embodiments of the invention are described, but with the understanding that the present disclosure is to be considered as but one example of the principles of the invention. It is not intended to limit the broad aspect of the invention to the illustrated embodiments.
The invention is an adhesive composition, which comprises either an A- or B-side epoxy, and further includes a plurality of microspheres blended into either the A-side epoxy alone, the B-side epoxy alone, or into both.
REFERENCES:
patent: 4548660 (1985-10-01), Ikeda et al.
patent: 4548863 (1985-10-01), Hicks et al.
patent: 4662663 (1987-05-01), Schmitz
patent: 4670339 (1987-06-01), Frey
patent: 4726986 (1988-02-01), Cannady, Jr. et al.
patent: 4772495 (1988-09-01), Headrick et al.
patent: 4853270 (1989-08-01), Wycech
patent: 4923902 (1990-05-01), Wycech
patent: 5610243 (1997-03-01), Vielti et al.
patent: 5663219 (1997-09-01), Choski et al.
Aylward D.
Daubert Chemical Company, Inc.
Dawson Robert
Wallenstein & Wagner Ltd.
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