Stock material or miscellaneous articles – All metal or with adjacent metals – Composite; i.e. – plural – adjacent – spatially distinct metal...
Patent
1995-10-27
1997-05-13
Bleutge, John C.
Stock material or miscellaneous articles
All metal or with adjacent metals
Composite; i.e., plural, adjacent, spatially distinct metal...
428416, 428418, 428457, 428555, 428570, 428594, 428615, 428642, 428643, 428644, 428674, 428675, 428676, 525504, 525510, 525526, B32B 1706, B32B 1520
Patent
active
056290985
ABSTRACT:
This invention relates to an adhesive composition, comprising: (A) at least one multifunctional epoxy; and (B) the composition derived from (B-1) at least one difunctional epoxy resin and (B-2) at least one compound represented by the formula
REFERENCES:
patent: 3958317 (1976-05-01), Peart et al.
patent: 4113684 (1978-09-01), Petrie
patent: 4310695 (1982-01-01), Dante
patent: 4323632 (1982-04-01), Berdan et al.
patent: 4348505 (1982-09-01), DiBenedetto et al.
patent: 4386939 (1983-06-01), Lange
patent: 4526940 (1985-07-01), Seymour et al.
patent: 4803543 (1989-02-01), Inayoshi et al.
patent: 4833204 (1989-05-01), Yusa et al.
patent: 5017271 (1991-05-01), Whewell et al.
Kanao et al, "New Adhesive Coated Copper Foil for Paper Phenolic Laminates," Technical Paper, IPC/ERSO Joint Conf., Oct. 17-19, 1989.
Chemical Abstract 112:180197g, "Manufacture of Poly(vinyl acetal) Resins," Issue 11, 1990.
Chemical Abstract 112:180932t, "Heat Resistant Adhesive Compositions Containing Modified Vinyl Acetal Resin for Circuit Boards," Issue 11, 1990.
Chemical Abstract 112:120226f, "Adhesive Compositions for Copper-Clad Laminates for Electric Circuit Boards," Issue 8, 1990.
Chemical Abstract 112:140937s, "Adhesives for Manufacture of Copper-Clad Laminates," Issue 9, 1990.
Chemical Abstract 111:116483z, "Graft Polymer-Containing Epoxy Resin Adhesives for Metal-Clad Laminates," Issue 21, 1989.
Chemical Abstract 112:8474j, "Adhesives for Metal-Clad Laminates," Issue 2, 1990.
Chemical Abstract 112:8555m, "Ahdesives for Copper-Clad Laminates," Issue 2, 1990.
Chemical Abstract 112:8556n, "Adhesives for Copper-Clad Laminates," Issue 2, 1990.
Chemical Abstract 111:155474s, "Coating of Copper Foil With Thermally Reactive Adhesive," Issue 23, 1989.
Chemical Abstract 111:116571b, "Adhesive-Coated Metal Foils," Issue 21, 1989.
Chemical Abstract 112:140938t, "Adhesives for Manufacture of Copper-Clad Laminates," Issue 9, 1990.
Chemical Abstract 117:173148s, "Adhesives for Bonding Metal Foils to Prepregs," Issue 23, 1992.
Chemical Abstract 117:113223c, "Manufacture of Adhesive-Coated Metal Foils for Laminates," Issue 20, 1992.
Chemical Abstract 117:252990p, "Adhesives for Copper-Clad Laminates," Issue 1, 1993.
Chemical Abstract 117:113086k, "Poly(vinyl butyral) Adhesives, Adhesive-Coated Copper Foils, and Copper, Clad Laminates," Issue 20, 1992.
Kovacs Andrea M.
Poutasse Charles A.
Sack Katherine V.
Winchester James R.
Bleutge John C.
Centanni Michael A.
Gould Electronics Inc.
Gulakowski Randy
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