Epoxy adhesives and bonded substrates

Details Epoxy adhesives and bonded substrates Epoxy adhesives and bonded substrates

2006-07-04

2006-07-04

Sellers, Robert (Department: 1712)

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Mixing of two or more solid polymers; mixing of solid...

C525S187000, C525S329100, C525S329500, C525S332700, C525S454000

Reexamination Certificate

active

07071263

ABSTRACT:
Epoxy adhesives are reported that comprise: (i) about 20% to about 40% weight of a reactive oligomer having a glass transition temperature of about −40° C. or less after curing and having at least two functional groups selected from epoxide, isocyanate, and amine; (ii) an amine curative; and (iii) an epoxide-group containing compound. The epoxy adhesives are resistant to thermal shock and have a low shear creep. The epoxy adhesives are particularly suitable for bonding substrates having mismatched coefficients of thermal expansion.

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