Epoxy adhesive for use with thermal ink-jet printers

Details Epoxy adhesive for use with thermal ink-jet printers Epoxy adhesive for use with thermal ink-jet printers

1989-07-11

1991-05-07

Gallagher, John J.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156330, 346140A, 525423, 528123, C09J 502

Patent

active

050133837

ABSTRACT:
An adhesive (14) is disclosed which is useful in bonding dissimilar adherends, such as silicon and plastic or stainless steel. The adhesive is particularly useful in bonding a printhead (12) and a pen body (10) for use in a thermal ink-jet printer, since it allows positioning of the printhead relative to the pen body prior to curing and, once cured, it seals against the aqueous-based ink contained within the pen body and provides structural integrity over the lifetime of the pen. The adhesive comprises a resin/hardener consisting essentially of a solid polyamide dispersed in an unmodified diglycidyl ether of bis-phenol A, an aliphatic epoxy silane coupling agent, and, optionally, a reactive diluent and/or fumed silica, and is given by the formulation

REFERENCES:
patent: 2970077 (1961-01-01), Grover
patent: 4070225 (1978-01-01), Batforf

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