Epoxy adhesive for structurally bonding molded SMC

Details Epoxy adhesive for structurally bonding molded SMC Epoxy adhesive for structurally bonding molded SMC

1982-06-01

1983-05-10

Jacobs, Lewis T.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Processes of preparing a desired or intentional composition...

523443, 523466, 524919, C08L 6304

Patent

active

043830609

ABSTRACT:
A novel adhesive has been developed that is particularly adapted for use in bonding automotive components made of sheet molding compound. It is comprised of suitable amounts of cross-linkable epoxy novolac resin; an epoxy flexibilizer; natural and colloidal silica; and an imidazole curing agent substituted in the one position with a short chain hydroxyalkyl group. The adhesive cures to a high bond strength in three minutes at 150.degree. C. It is resistant to degradation due to temperatures up to 200.degree. C., salt spray, humidity and water soak.

REFERENCES:
patent: 4187348 (1980-02-01), Dearlove et al.
patent: 4273686 (1981-06-01), Noland et al.

Affiliated with

Also associated with

Rating

Epoxy adhesive for structurally bonding molded SMC does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Epoxy adhesive for structurally bonding molded SMC, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Epoxy adhesive for structurally bonding molded SMC will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-526673