Epoxy adhesive film for electronic applications

Details Epoxy adhesive film for electronic applications Epoxy adhesive film for electronic applications

1987-03-12

1988-09-06

Bleutge, John C.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Processes of preparing a desired or intentional composition...

523427, 523428, 525524, 525525, 525930, C08K 906, C08L 6300

Patent

active

047693991

ABSTRACT:
An adhesive composition which is particularly suitable for use as a die-attach adhesive. The adhesive composition comprises the reaction product of an admixture of an effective amount of a phenoxy resin, at least one epoxy resin and a fluorene curative.

REFERENCES:
patent: 3873637 (1975-03-01), Fujiwara et al.
patent: 3888942 (1975-06-01), Tsen
patent: 4591623 (1986-05-01), Nakajima et al.
patent: 4644023 (1987-02-01), Gray

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