Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Processes of preparing a desired or intentional composition...
Patent
1989-09-25
1990-11-13
Anderson, Harold D.
Synthetic resins or natural rubbers -- part of the class 520 ser
Synthetic resins
Processes of preparing a desired or intentional composition...
1621643, 524606, 524607, C08L 7706
Patent
active
049702505
ABSTRACT:
A composition comprising epoxidized polyamide wet strength resin and lecithin. The composition provides wet strength to paper and molded pulp products and at the same time increases the internal bonding of the paper or molded pulp products.
REFERENCES:
patent: 1977251 (1934-10-01), Stallman
patent: 3565754 (1971-02-01), Dach's et al.
patent: 3694390 (1972-09-01), Winslow
patent: 3733290 (1973-05-01), Williams et al.
patent: 3793279 (1974-02-01), Lipowski
patent: 3887510 (1975-06-01), Chan et al.
patent: 3914155 (1975-10-01), Horowitz
patent: 3947383 (1976-03-01), Baggett
patent: 3951921 (1976-09-01), Espy
patent: 4076896 (1978-03-01), Bunkowski
patent: 4267240 (1981-05-01), Jaisle et al.
patent: 4501862 (1985-02-01), Keim
patent: 4634727 (1987-02-01), Kamikasada
patent: 4722964 (1988-02-01), Chan
Japanese Patent Publication JP55--139430 (Publication of Abstract) of 10/31/80 to Matsushita Elec. Works.
Japanese Pat. Pub. J.P. 64--45894 (Abstract and Publication) of 2/20/89 to OJI Paper KK. Jap. Pat. Pub. JP88--057206 (English Abstract and Publication) of 11/10/88 to KOBE.
Duncan Thomas F.
Martinez Elmer D.
Anderson Harold D.
Borden Inc.
Maskas G. P.
Rainear D. H.
Van Wyck K. P.
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