Epitaxial growth method and apparatus therefor

Coating apparatus – Gas or vapor deposition – Work support

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

118715, C23C 1600

Patent

active

048482730

ABSTRACT:
In an epitaxial growth method of this invention, a first gas consisting of a hydrogen diluted gas containing a Group V element is continuously flowed on a monocrystalline substrate that is placed in a reaction chamber, the monocrystalline substrate is arranged in a gas mixing region where the first gas and a second gas containing a halogenide of a Group III element are mixed adjacent to the monocrystalline substrate, and a Group III-V compound semiconductor is grown on the monocrystalline substrate.

REFERENCES:
patent: 3312570 (1967-04-01), Ruehrwein
patent: 3312571 (1967-04-01), Ruehrwein
patent: 3594242 (1971-07-01), Burd et al.
patent: 4088515 (1978-05-01), Blakeslee
patent: 4204893 (1980-05-01), Cox
patent: 4253887 (1987-03-01), Jolly
patent: 4407694 (1983-10-01), Eu et al.
patent: 4488914 (1984-12-01), Qunilan et al.
patent: 4561916 (1985-12-01), Akiyama et al.
patent: 4579609 (1986-04-01), Reif et al.
patent: 4588451 (1986-05-01), Vernon
patent: 4629532 (1986-12-01), Yanase et al.
patent: 4645689 (1987-02-01), Cox
patent: 4664743 (1987-05-01), Moss
patent: 4736705 (1988-04-01), Weyburne
Journal article entitled "Growth of GaAs on Si by MOCVD", by Masahiro Akiyama et al., Journal of Crystal Growth 69 (1984) 21-26, North Holland, Amsterdam.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Epitaxial growth method and apparatus therefor does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Epitaxial growth method and apparatus therefor, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Epitaxial growth method and apparatus therefor will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-163056

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.