Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2006-08-22
2006-08-22
Feild, Lynn (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S704000, C361S713000
Reexamination Certificate
active
07095615
ABSTRACT:
A circuit card assembly and a method for manufacturing the circuit card assembly are disclosed. The circuit card assembly includes a printed wiring board with electronic components bonded thereto. The printed wiring board and electronic components are placed in an outer shell made of lightweight stiff material. The spaces or voids between the outer shell and the printed wiring board and the electronic components are filled with lightweight filling material and thermal filler material. The outer shell and the filling material provide increased rigidity to the electronic components and the thermal filler material increases heat transfer from a given electronic component to outside the circuit card assembly.
REFERENCES:
patent: 4409641 (1983-10-01), Jakob et al.
patent: 4546412 (1985-10-01), Nakazawa et al.
patent: 4612601 (1986-09-01), Watari
patent: 4764845 (1988-08-01), Artus
patent: 4849858 (1989-07-01), Grapes et al.
patent: 5009311 (1991-04-01), Schenk
patent: 5208732 (1993-05-01), Baudouin et al.
patent: 5293002 (1994-03-01), Grenet et al.
patent: 5396403 (1995-03-01), Patel
patent: 5508885 (1996-04-01), Ishimoto
patent: 5541448 (1996-07-01), Carpenter
patent: 5646831 (1997-07-01), Manteghi
patent: 5672414 (1997-09-01), Okamoto et al.
patent: 5717160 (1998-02-01), Bootle
patent: 5724729 (1998-03-01), Sherif et al.
patent: 5768104 (1998-06-01), Salmonson et al.
patent: 5777847 (1998-07-01), Tokuno et al.
patent: 5812375 (1998-09-01), Casperson
patent: 5887435 (1999-03-01), Morton
patent: 6101090 (2000-08-01), Gates
patent: 6101094 (2000-08-01), Kermaani et al.
patent: 6175501 (2001-01-01), Bortolini et al.
patent: 6317324 (2001-11-01), Chen et al.
patent: 6452804 (2002-09-01), Dibene, II et al.
patent: 2002/0158330 (2002-10-01), Moon et al.
patent: 199 10500 (2000-10-01), None
patent: 0 863 694 (1998-09-01), None
patent: 4-329697 (1992-11-01), None
Feild Lynn
Fogg David N.
Fogg & Associates LLC
Hoffberg Robert J.
Honeywell International , Inc.
LandOfFree
Environmentally tuned circuit card assembly and method for... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Environmentally tuned circuit card assembly and method for..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Environmentally tuned circuit card assembly and method for... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3649083