Environmentally protected electronic housing and heat sink struc

Details Environmentally protected electronic housing and heat sink struc Environmentally protected electronic housing and heat sink struc

1977-02-28

1978-08-29

Truhe, J. V.

Electricity: conductors and insulators

With fluids or vacuum

With cooling or fluid feeding, circulating or distributing

357 81, H05K 503

Patent

active

041105494

ABSTRACT:
To mount power semiconductor units at the exposed surfaces of a housing structure for electronic components such as, for example, transistorized ignitions, without the loss of heat sink and heat radiation effects, while still protecting the electronic components, a protective cover is placed over the electronic component and at least a portion of the housing end wall, the cover being so dimensioned that it offers little resistance to radiation of heat by the housing end wall; the cover may be a layer of paint or a plastic hood or cap having end walls fitting against the housing end wall which are spaced from the electronic component by a distance which is sufficient to permit the housing end wall to act as a heat sink. If paint is used, the semiconductor is preferably located in a depression formed in the housing end wall so that paint can accumulate at the edges of the semiconductor thus providing effective protection.

REFERENCES:
patent: 1072047 (1913-09-01), Shepard
patent: 2714912 (1955-08-01), Gonnella
patent: 3228445 (1966-01-01), Mayotte
patent: 3377524 (1968-04-01), Bock et al.
patent: 3704738 (1972-12-01), LeCompte
patent: 3805123 (1974-04-01), Rieger

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