Environmentally isolated enclosure for electronic components

Details Environmentally isolated enclosure for electronic components Environmentally isolated enclosure for electronic components

1997-04-04

1999-05-25

Thompson, Gregory

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

622592, 174 151, 165 804, 16510433, 361696, H05K 720

Patent

active

059074736

ABSTRACT:
A spray cooled enclosure and method for obtaining a substantially improved operating environment for at least one electronic component/card located within the enclosure. The spray cooled enclosure includes a closed compartment that isolates the electronic components/cards from the environment. A dielectric heat transfer fluid stored within the closed compartment is distributed by a spraying system such that a thin-film layer of the heat transfer fluid is continually formed over a substantial portion of the surfaces of the electronic components/cards resulting in a substantially reduced thermal gradient across the electronic components/cards. Also included is a closed-loop condensing system for condensing the heat transfer fluid vaporized in response to heat transferred from the electronic components/cards to the layer of heat transfer fluid.

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