Cleaning and liquid contact with solids – Processes – Using sequentially applied treating agents
Reexamination Certificate
2006-02-17
2010-12-07
Markoff, Alexander (Department: 1711)
Cleaning and liquid contact with solids
Processes
Using sequentially applied treating agents
C134S001000, C134S001100, C134S001200, C134S001300, C134S004000, C134S006000, C134S007000, C134S026000
Reexamination Certificate
active
07846266
ABSTRACT:
Cleaning and reclaiming nano-imprint templates using environment friendly methods and systems is disclosed. A template may be cleaned by a combination of exposure to activated gaseous species followed by rinsing with oxygenated or hydrogenated DI water and exposure to reactive plasma to remove organic contaminant. Contaminant may be removed by forming a coating film of a water soluble polymer on the template and then peeling off the coating film. Organic residue from the film may be removed using oxygenated plasma.
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Gim S. Chen, “The Application of DI-O3 Water on Wafer Surface Preparation” downloaded from the internet on Feb. 7, 2006, downloaded from: <http://www.akrion.com/apex/pdfs/dio3prep.pdf#search=‘Gim%20S.%20Chen’>.
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Isenberg Joshua D.
JDI Patent
KLA-Tencor Technologies Corporation
Markoff Alexander
LandOfFree
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