Environment exchange control for material on a wafer surface

Details Environment exchange control for material on a wafer surface Environment exchange control for material on a wafer surface

2005-01-18

2005-01-18

Jolley, Kirsten C. (Department: 1762)

Coating processes

Centrifugal force utilized

C427S377000, C427S421100, C427S425000, C118S052000, C118S320000, C438S758000

Reexamination Certificate

active

06844027

ABSTRACT:
Systems and methods are described for environmental exchange control for a polymer on a wafer surface. An apparatus for controlling an exchange between an environment and a polymer on a surface of a wafer located in the environment includes: a chamber adapted to hold the wafer, define the environment, and maintain the polymer in an adjacent relationship with the environment; and a heater coupled to the chamber. A method for improving performance of a spin-on material includes: forming the spin-on material on a surface of a wafer; then locating the spin-on material in an environment so that said environment is adjacent said spin-on material; and then controlling an exchange between the spin-on material and said environment. The systems and methods provide advantages because inappropriate deprotection is mitigated by careful control of the environmental temperature and environmental species partial pressures (e.g. relative humidity).

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