Envelope flap moistening apparatus

Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – Automatic and/or material-triggered control

Reexamination Certificate

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Details

C156S442200, C156S442400, C156S441500, C347S014000, C118S684000

Reexamination Certificate

active

06913054

ABSTRACT:
A device for moistening an envelope flap includes a mechanism which defines an envelope feed path and a plate disposed adjacent the envelope feed path. The plate passes between the envelope body and the envelope flap. A plurality of orifices formed in the plate discharge moistening fluid received from a reservoir onto the envelope flap. The moistening device also includes a valve mechanism to selectively supply each of the orifices with moistening fluid from the reservoir. A flap sensing mechanism is disposed adjacent the envelope feed path for sensing an edge portion of the envelope flap and operatively connected to the valve mechanism to supply signals to the valve mechanism to selectively actuate the valve mechanism to selectively supply moistening fluid to the orifices in response to the sensing of the edge portion of the envelope flap.

REFERENCES:
patent: 3911862 (1975-10-01), Lupkas
patent: 4730197 (1988-03-01), Raman et al.
patent: 5007371 (1991-04-01), O'Dea et al.
patent: 5252353 (1993-10-01), DiGiulio et al.
patent: 5840123 (1998-11-01), Holbrook
patent: 6193825 (2001-02-01), Dolan
patent: 6361603 (2002-03-01), Salomon
patent: 2003/0136337 (2003-07-01), Gregoire et al.

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