Envelope, envelope manufacturing method, image display...

Electric lamp and discharge devices – With luminescent solid or liquid material – With gaseous discharge medium

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C257S079000, C313S634000

Reexamination Certificate

active

10647287

ABSTRACT:
Provided is an envelope which includes: a first substrate; a second substrate opposed to the first substrate; a frame interposed between the first substrate and the second substrate; and a low melting point metal for bonding the first substrate and the frame to each other. In particular, in such a configuration, the substrate or the frame has a first region and a second region which are brought into contact with the low melting point metal, and in the first region, a material capable of higher maintaining airtightness with the low melting point metal than the second region is in contact with the low melting point metal, while in the second region, a material having a stronger binding power on the low melting point metal than the first region is in contact with the low melting point metal.

REFERENCES:
patent: 5455597 (1995-10-01), Nakamura et al.
patent: 5659329 (1997-08-01), Yamanobe et al.
patent: 6060113 (2000-05-01), Banno et al.
patent: 6137218 (2000-10-01), Kaneko et al.
patent: 6254449 (2001-07-01), Nakanishi et al.
patent: 6283813 (2001-09-01), Kaneko et al.
patent: 6296896 (2001-10-01), Takahashi et al.
patent: 6506089 (2003-01-01), Nakanishi et al.
patent: 6624586 (2003-09-01), Abe et al.
patent: 2002/0180342 (2002-12-01), Yamada et al.
patent: 2002/0190633 (2002-12-01), Tagawa et al.
patent: 2002/0192935 (2002-12-01), Joshi et al.
patent: 2003/0058192 (2003-03-01), Arai et al.
patent: 2003/0067263 (2003-04-01), Tokioka et al.
patent: 2003/0201462 (2003-10-01), Pommer et al.
patent: 64-31332 (1989-02-01), None
patent: 6-342636 (1994-12-01), None
patent: 7-326311 (1995-12-01), None
patent: 8-185818 (1996-07-01), None
patent: 9-505757 (1997-02-01), None
patent: 9-102271 (1997-04-01), None
patent: 11-135018 (1999-05-01), None
patent: 2005-251665 (2000-09-01), None
patent: 2001-210258 (2001-08-01), None
patent: 2002-182585 (2002-06-01), None
patent: 2002-184329 (2002-06-01), None
M. Hartwell et al, “Strong electron emission from patterned tin-indium oxide thin films”, International Electron Devices Meeting 1975, Washington, D.C., Catalog No. 75, CH1023-1,IEDM Technical Digest, pp. 519-521.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Envelope, envelope manufacturing method, image display... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Envelope, envelope manufacturing method, image display..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Envelope, envelope manufacturing method, image display... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3959317

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.