Drying and gas or vapor contact with solids – Apparatus – With means to treat gas or vapor
Patent
1976-08-04
1979-03-13
Camby, John J.
Drying and gas or vapor contact with solids
Apparatus
With means to treat gas or vapor
34 10, 34 58, F26B 308
Patent
active
041434692
ABSTRACT:
In a process that involves use of a fluidized bed of solid particulate material wherein fluidization is obtained by passge of a gas through the bed, and the bed is stabilized by including discrete magnetizable particles in the bed and applying a substantially uniform magnetic field to the bed, temperature gradients that occur in the bed when the process in which the fluidized bed is used involves release or absorption of heat are reduced by periodically removing the magnetic field in a cyclical fashion. The period of magnetic field removal is long enough to destabilize the fluidized bed with respect to the positioning of fluidized particles so that the particles will move about in the bed, but the period of removal is not so long as to permit the unstabilized bed to exhibit a boiling or bubbling effect. The ratio of "on" time to "off" time is generally within the range of from about 4 to 1 to about 4000 to 1.
REFERENCES:
patent: 1643663 (1927-09-01), Klatte et al.
patent: 3219318 (1965-11-01), Hershler
patent: 3304249 (1967-02-01), Katz
patent: 3439899 (1969-04-01), Hershler
patent: 3440731 (1969-04-01), Tuthill
patent: 3933883 (1976-01-01), Parthasarathy
patent: 3989734 (1976-11-01), Alpert et al.
Camby John J.
Dimmick Byron O.
Exxon Research & Engineering Co.
Halluin Albert P.
Schwartz Larry I.
LandOfFree
Enhancing the thermal characteristics of magnetically stabilized does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Enhancing the thermal characteristics of magnetically stabilized, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Enhancing the thermal characteristics of magnetically stabilized will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2365606