Enhancing signal path characteristics in a circuit board

Details Enhancing signal path characteristics in a circuit board Enhancing signal path characteristics in a circuit board

2006-05-16

2006-05-16

Cuneo, Kamand (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C361S761000, C361S780000, C361S794000, C029S852000

Reexamination Certificate

active

07045719

ABSTRACT:
A circuit board includes multiple signal layers, in which signal lines are routed, and power reference plane layers, in which power reference planes (e.g., power supply voltage or ground) are provided. Vias are passed through at least one signal layer and at least one power reference plane layer, or alternatively, vias are passed through at least two power reference plane layers. In one arrangement, a first clearance is defined around the via at the signal layer and a second clearance is defined around the via at the power reference plane layer. The second clearance is larger in size than the first clearance to match or tailor the impedance of the via as closely as possible with the impedance of the signal line that the via is electrically connected to. In another arrangement, clearances around vias at different power reference plane layers are selected to have different sizes to enhance the ability of one of the power reference plane layers (the one with a smaller clearance size) to carry a higher current level.

REFERENCES:
patent: 4868350 (1989-09-01), Hoffarth et al.
patent: 6229095 (2001-05-01), Kobayashi
patent: 6353999 (2002-03-01), Cheng
U.S. Appl. No. 10/641,476, filed Aug. 15, 2003, Alexander et al.
U.S. Appl. No. 10/145,436, filed May 14, 2002, Alexander et al.

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