Enhancing bonding at metal-ceramic interfaces

Details Enhancing bonding at metal-ceramic interfaces Enhancing bonding at metal-ceramic interfaces

1990-12-10

1991-12-24

Lowe, James

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

228120, 228903, B32B 3124

Patent

active

050749412

ABSTRACT:
Metal-ceramic interfaces of enhanced strength are produced by positioning bodies of ceramic oxides and transition element metals or alloys containing such in abutting relationship, and heating in air at a temperature ranging from 500.degree. C. to just below the melting point of the metal of the metal body to join said bodies and then subsequently heat treating said joined bodies in a reducing atmosphere at a temperature in the range of 300.degree. C. to 1200.degree. C. to form intermetallic compound layer at the interface.

REFERENCES:
patent: 2800710 (1957-07-01), Dunn
patent: 3531853 (1970-10-01), Klomp
patent: 3753774 (1973-08-01), Veloric
patent: 3994430 (1976-11-01), Cusano et al.
patent: 4017890 (1977-04-01), Howard et al.
patent: 4050956 (1977-09-01), de Bruin et al.
patent: 4154874 (1979-05-01), Howard et al.
patent: 4404235 (1983-09-01), Tarug et al.
patent: 4470537 (1984-09-01), Diem et al.
patent: 4542073 (1985-09-01), Tanaka et al.
patent: 4591401 (1986-05-01), Neidig et al.
patent: 4631099 (1986-12-01), Ebata et al.
patent: 4720401 (1988-01-01), Ho et al.
patent: 4763828 (1988-08-01), Fukaya et al.
patent: 4824008 (1989-04-01), Luszcz et al.
Kennefick, C. M., et al., Acta Metall., vol. 37, No. 11, pp. 2947-2952, 1989.
Shieu, F. S., et al., Acta metall. mater., vol. 38, No. 11, pp. 2215-2224, 11/90.

Affiliated with

Also associated with

Rating

Enhancing bonding at metal-ceramic interfaces does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Enhancing bonding at metal-ceramic interfaces, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Enhancing bonding at metal-ceramic interfaces will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-41256