Cleaning compositions for solid surfaces – auxiliary compositions – Cleaning compositions or processes of preparing – For cleaning a specific substrate or removing a specific...
Reexamination Certificate
2004-03-01
2009-06-30
Douyon, Lorna M (Department: 1796)
Cleaning compositions for solid surfaces, auxiliary compositions
Cleaning compositions or processes of preparing
For cleaning a specific substrate or removing a specific...
C510S176000, C510S421000, C510S426000, C510S432000, C134S002000, C134S003000, C134S025400, C134S041000, C134S042000
Reexamination Certificate
active
07553803
ABSTRACT:
A method and composition for removing silicon-containing particulate material, such as silicon nitrides and silicon oxides, from patterned Si/SiO2semiconductor wafer surfaces is described. The composition includes a supercritical fluid (SCF), an etchant species, a co-solvent, a surface passivator, a binder, deionized water, and optionally a surfactant. The SCF-based compositions substantially remove the contaminating particulate material from the wafer surface prior to subsequent processing, thus improving the morphology, performance, reliability and yield of the semiconductor device.
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Baum Thomas H.
Korzenski Michael B.
Advanced Technology & Materials Inc.
Douyon Lorna M
Fuierer Tristan A.
Lin Chih-Sheng
Moore & Van Allen PLLC
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