Specialized metallurgical processes – compositions for use therei – Processes – Free metal or alloy reductant contains magnesium
Patent
1994-07-28
1996-01-16
Rosenberg, Peter D.
Specialized metallurgical processes, compositions for use therei
Processes
Free metal or alloy reductant contains magnesium
75721, 75723, 502 20, C22B 1108
Patent
active
054844703
ABSTRACT:
An improved process for dissolving gold metal in ligand and oxidant lixiviation systems, wherein the solubility of gold is enhanced by the addition of heterocyclic aromatic compounds containing nitrogen or sulfur in the ring.
REFERENCES:
patent: 3597290 (1971-08-01), Nalto et al.
patent: 4654145 (1987-03-01), Demopoulos
patent: 4675172 (1987-06-01), Quan
patent: 4696801 (1987-09-01), Devonalel
patent: 4724129 (1988-02-01), Helgorsky
patent: 4997532 (1991-03-01), Flax
patent: 5131943 (1992-07-01), Allison
patent: 5169503 (1992-12-01), Baughmann
patent: 5182026 (1993-01-01), Pike
patent: 5213777 (1993-05-01), Dalton
patent: 5250272 (1993-10-01), Knorre
patent: 5256187 (1993-10-01), Gefvert
Amsterdam, NL, "Dissolution kinetics of gold in iodide solutions", Hydrometallurgy, vol. 27, 1991, pp. 47-62.
Hiskey, J. B., et al., Mineral Processing & Extractive Mettalurgy Review, 4, 95-134, 1988.
Zhang, Z., et al., Huaxue Shiji, 137-139, 1982.
Iqbal, M., et al., Radiochim. Acta., 22, 37-39, 1975.
Abstract: U.S. Pat. No. 4,654,145.
Abstract: Japan 01111824.
Kristjansdottir Sigridur S.
Thompson Jeffery S.
E. I. Du Pont de Nemours and Company
Frank George A.
Geiger Kathleen W.
Rosenberg Peter D.
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