Enhancement of current-carrying capacity of a multilayer...

Details Enhancement of current-carrying capacity of a multilayer... Enhancement of current-carrying capacity of a multilayer...

2005-02-01

2005-02-01

Cuneo, Kamand (Department: 2841)

Metal working

Method of mechanical manufacture

Electrical device making

C361S792000, C361S760000, C438S108000, C438S610000, C257S678000, C257S700000, C174S266000

Reexamination Certificate

active

06848178

ABSTRACT:
A multilayer circuit board, in which a plurality of insulating layers and a plurality of conductive layers, each of which includes a conductive pattern, have been laminated, includes an insulating layer, a conductive compound, and a conductive pattern. The insulating layer has a trench. The conductive compound is located in the trench. The conductive pattern adjoins the trench and is electrically connected to the conductive compound. The conductive pattern and the conductive compound make up a conductive wire that has a higher current-carrying capacity than the conductive pattern.

REFERENCES:
patent: 5883335 (1999-03-01), Mizumoto et al.
patent: 6139777 (2000-10-01), Omoya et al.
patent: 20020094604 (2002-07-01), Hayama et al.
patent: 20040043596 (2004-03-01), Sakaki et al.
patent: A-H10-117069 (1998-05-01), None

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