Enhancement mode III-nitride semiconductor device with...

Active solid-state devices (e.g. – transistors – solid-state diode – Heterojunction device – Field effect transistor

Reexamination Certificate

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C257S183000

Reexamination Certificate

active

07745849

ABSTRACT:
An enhancement mode III-nitride heterojunction device that includes a region between the gate and the drain electrode thereof that is at the same potential as the source electrode thereof when the device is operating.

REFERENCES:
patent: 3697786 (1972-10-01), Smith
patent: 2006/0118809 (2006-06-01), Parikh et al.
patent: 2007/0235775 (2007-10-01), Wu et al.
patent: 2007/0278518 (2007-12-01), Chen et al.
Monolithic Integration of Enhancement-and Depletion-mode AlGaN/GaN HEMTs for GaN Digital Integrated Circuits—Yong Cai et al.—Dept. of Electrical and Electronic Engineering, Hong Kong University of Science and Technology, Hong Kong—4 pages.
Self-aligned Enhancement-Mode AlGaN/GaN HEMTs Using Fluoride-based Plasma Treatment—Yong Cai et al.—Dept. of Electrical and Electronic Engineering Hong Kong University of Science and Technology, Hong Kong—179-180.
High-Performance Enhancement-Mode AlGaN/GaN HEMTs Using Fluoride-based Plasma Treatment—Yong Cai et al.—IEEE Electron Device Letters, vol. 26, No. 7—Jul. 2005—pp. 435-437.
Enhancement-Mode AlGaN/GaN HEMTs on Silicon Substrate—Shuo Jia et al. IEEE Transactions on Electron Devices, vol. 53, No. 6, Jun. 2006—pp. 1471-1477.
Reliability of Enhancement-mode AlGaN/GaN HEMTs Fabricated by Fluorine Plasma Treatment—Congwen Yi et al.—Dept. of Electronic and Computer Engineering, Hong Kong University of Science and Technology, Hong Kong—pp. 389-392.
Planar Integration of E/D-Mode AlGaN/GaN HEMTs using Fluoride-Based Plasma Treatment—Ruonan Wang et al.—IEEE Electron Device Letters, vol. 27, No. 8, Aug. 2006—pp. 633-635.
Control of Threshold Voltage of AlGaN/GaN HEMTs by Fluoride-Based Plasma Treatment: From Depletion Mode to Enhancement Mode—Yong Cai et al.—IEEE Transactions on Electron Devices, vol. 53, No. 9, Sep. 2006—pp. 2207-2215.
Normally Off AlGaN/GaN Low-Density Drain HEMT (LDD-HEMT) With Enhanced Breakdown Voltage and Reduced Current Collapse—Di Song et al.—IEEE Electron Device Letters, vol. 28, No. 3, Mar. 2007—pp. 189-191.
High-Breakdown Enhancement-Mode AlGaN/GaN HEMTs with Integrated Slant Field-Plate—C.S. Suh et al.—Electrical and Computer Engineering Department—3 pages.

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