Enhanced wire-bondable leadframe

Details Enhanced wire-bondable leadframe Enhanced wire-bondable leadframe

1996-01-16

1998-10-06

Picardat, Kevin

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

438111, H01L 2160

Patent

active

058175440

ABSTRACT:
A method for improving adhesion from a leadframe to a metallic wire is disclosed including using a laser beam to remove selected areas of an package adhesion enhancing layer to expose a layer on the leadframe which has a higher adhesion to metallic wires. The package adhesion enhancing layer is from the group consisting essentially of aluminum oxide, anti-tarnish finishes, and dielectrics.
The exposed layer on the leadframe is selected from the group consisting essentially of silver, nickel, palladium.

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